Services

Everything from bare board to tested system.

A full range of printed circuit board assembly and mechanical assembly, for prototype, pre-production, and production. One domestic partner, accountable from first board to last.


SVC·01

PCB Assembly

Surface-mount, through-hole, and mixed-technology assembly with automated placement and inspection.

  • SMT01005 to large BGA, fine-pitch & QFN
  • THTHand & selective solder, press-fit
  • VOLPrototype · pre-production · production
  • LAYERSSingle, double, and high-layer-count boards
SVC·02

System Manufacturing

Box build, cabling, and full mechanical integration: a finished, tested system out the door.

  • BUILDBox build & enclosure integration
  • CABLECable & harness assembly
  • TURNFull and partial turn-key programs
  • SHIPConfigure, label, and drop-ship
SVC·03

Manufacturing & Process Engineering

Repeatable, documented processes engineered for yield, signal integrity, and thermal reliability, tuned before the first board runs.

  • DEVProcess development & characterization
  • THERMReflow & thermal profiling
  • SPCStatistical process control
  • DOCWork instructions & traceability
SVC·04

Materials & Logistics

Sourcing that held through the chip-shortage years, with the visibility to keep your line moving.

  • SRCVetted multi-source supplier network
  • KITKitting & consignment programs
  • INVManaged inventory & buffer stock
  • LEADLead-time you set, not the shop
SVC·05

Design Analysis

DFM, DFT, and BOM scrubbing that surfaces problems before a single part is placed.

  • DFMFootprint, package & thermal review
  • DFTTest-point & coverage analysis
  • BOMSourcing, lifecycle & cost scrub
  • SIGSignal- & power-integrity review
SVC·06

Test Solutions

Defects caught on the line, not in the field, with rework expertise most shops won't attempt.

  • AOIAutomated optical inspection, every build
  • FCTFunctional & in-circuit test fixtures
  • XRAYX-ray inspection for hidden joints
  • RWKDecap, repopulation & chip-level repair
SVC·07

Process Capabilities

Every program complies with ISO 9001:2015, IPC-A-610, and J-STD-001, backed by the equipment and tolerances to meet it, build after build.

  • PLACEUp to ~171,000 placements / hour
  • PANELBoards up to 18" × 24"
  • FINE01005 · 0.4mm BGA · 0.25mm CSP
  • COMPLYISO 9001:2015 · IPC-A-610 · J-STD-001
SVC·08

Facility & Equipment

A 40,000-square-foot floor in San Jose, built for high-reliability work: four SMT work cells, full soldering and rework, and inline inspection.

  • SPACE40,000 SF · San Jose, CA
  • SMT4 Juki work cells + nitrogen reflow
  • SOLDERWave, selective & hand · Sn63/Pb37 · SAC 305
  • INSPECTAOI · X-ray · flying probe · thermal

Process capability

A 99%+ first-pass yield is the spec, not the goal.

We comply with the heat-cycle limits manufacturers publish, hold internal rework under 1%, and treat every reflow as reliability you don't get back.

99%+
First-pass yield
<1%
Internal rework
30yrs
In Silicon Valley
100%
US-built

Start a build

Send us your design. We'll tell you how to build it right.

Schedule a call
Phone(408) 433-4700
Facility81 Bonaventura Dr, San Jose, CA